Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via
Author :
Publisher : Springer
Total Pages : 286
Release :
ISBN-10 : 9789401790383
ISBN-13 : 9401790388
Rating : 4/5 (388 Downloads)

Book Synopsis Electrical Design of Through Silicon Via by : Manho Lee

Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.


Electrical Design of Through Silicon Via Related Books

Electrical Design of Through Silicon Via
Language: en
Pages: 286
Authors: Manho Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2014-05-11 - Publisher: Springer

DOWNLOAD EBOOK

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems wit
Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
Language: en
Pages: 226
Authors: Renato Rimolo-Donadio
Categories: Science
Type: BOOK - Published: 2011 - Publisher: Logos Verlag Berlin GmbH

DOWNLOAD EBOOK

This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A f
Advanced Interconnects for ULSI Technology
Language: en
Pages: 616
Authors: Mikhail Baklanov
Categories: Technology & Engineering
Type: BOOK - Published: 2012-04-02 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served w
Passive Macromodeling
Language: en
Pages: 912
Authors: Stefano Grivet-Talocia
Categories: Technology & Engineering
Type: BOOK - Published: 2015-10-30 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Offers an overview of state of the art passive macromodeling techniques with an emphasis on black-box approaches This book offers coverage of developments in li
Integrated Optical Interconnect Architectures for Embedded Systems
Language: en
Pages: 286
Authors: Ian O'Connor
Categories: Technology & Engineering
Type: BOOK - Published: 2012-11-07 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance comput