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Advanced Flip Chip Packaging
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Authors: Ho-Ming Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2013-03-20 - Publisher: Springer Science & Business Media

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro
Materials for Advanced Packaging
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Authors: Daniel Lu
Categories: Technology & Engineering
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Semiconductor Advanced Packaging
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Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Integrated Circuit Packaging, Assembly and Interconnections
Language: en
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Authors: William Greig
Categories: Technology & Engineering
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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces
Advanced Packaging
Language: en
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Authors:
Categories:
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Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing