Find (PDF) Electronic Packaging Materials Science X Volume 515 for Read Full

Language: en
Pages: 288

Electronic Packaging Materials Science X: Volume 515

Authors: Daniel J. Belton

Categories: Technology & Engineering

Type: BOOK - Published: 1998-10 - Publisher:

Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial a

Language: en
Pages: 203

Molecular Modeling and Multiscaling Issues for Electronic Material Applications

Authors: Artur Wymyslowski

Categories: Technology & Engineering

Type: BOOK - Published: 2014-11-20 - Publisher: Springer

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This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to u

Language: en
Pages: 297

Composite Materials

Authors: Deborah D.L. Chung

Categories: Technology & Engineering

Type: BOOK - Published: 2013-06-29 - Publisher: Springer Science & Business Media

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Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal ma