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High Temperature Packaging for Wide Bandgap Semiconductor Devices
Language: en
Pages: 107
Authors: Brian J. Grummel
Categories: Electronic packaging
Type: BOOK - Published: 2008 - Publisher:

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Currently, wide bandgap semiconductor devices feature increased efficiency, higher current handling capabilities, and higher reverse blocking voltages than sili
Materials for High-Temperature Semiconductor Devices
Language: en
Pages: 135
Authors: National Research Council
Categories: Technology & Engineering
Type: BOOK - Published: 1995-09-14 - Publisher: National Academies Press

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Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the
Design and Characterization of High-temperature Packaging for Wide-bandgap Semiconductor Devices
Language: en
Pages: 140
Authors: Brian J. Grummel
Categories:
Type: BOOK - Published: 2012 - Publisher:

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This was confirmed by electrical resistivity measurement, EDS, FIB, and SEM characterization. Thermal and mechanical characterization of TLP die-attached sample
Wide Bandgap Power Semiconductor Packaging
Language: en
Pages: 242
Authors: Katsuaki Suganuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-05-28 - Publisher: Woodhead Publishing

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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integr
High-Performance Packaging Technology for Wide Bandgap Semiconductor Modules
Language: en
Pages:
Authors: Paul Mumby-Croft
Categories: Technology
Type: BOOK - Published: 2018 - Publisher:

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The properties of wide band gap (WBG) semiconductors are beneficial to power electronics applications ranging from consumer electronics and renewable energy to