Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the
This was confirmed by electrical resistivity measurement, EDS, FIB, and SEM characterization. Thermal and mechanical characterization of TLP die-attached sample
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integr
The properties of wide band gap (WBG) semiconductors are beneficial to power electronics applications ranging from consumer electronics and renewable energy to