This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essen
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of pl
The result of the nano education project run by the Korean Nano Technology Initiative, this has been recommended for use as official textbook by the Korean Nano
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device archi