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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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Authors: Hengyun Zhang
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Type: BOOK - Published: 2019-11-14 - Publisher: Woodhead Publishing

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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysi
Advances in Robotics, Automation and Data Analytics
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This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics wh
Heat Exchangers
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The demand for energy to satisfy the basic needs and services of the population worldwide is increasing as are the economic costs associated with energy product
Heat Exchangers
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The last few decades have seen huge developments in the use of concentrated solar power plants, communications technologies (mobile telephony and 5G networks),
Power Electronic Packaging
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Authors: Yong Liu
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Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe