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Type: BOOK - Published: 2017-07-24 - Publisher: John Wiley & Sons
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
Language: en
Pages: 867
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Type: BOOK - Published: 2022-05-28 - Publisher: Springer Nature
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total
Language: en
Pages: 586
Pages: 586
Type: BOOK - Published: 2011-05-17 - Publisher: John Wiley & Sons
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Language: en
Pages: 606
Pages: 606
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
Language: en
Pages: 93
Pages: 93
Type: BOOK - Published: 2011-06-20 - Publisher: Now Publishers Inc
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the s
