Advances In 3d Integrated Circuits And Systems

Advances In 3d Integrated Circuits And Systems
Author :
Publisher : World Scientific
Total Pages : 392
Release :
ISBN-10 : 9789814699037
ISBN-13 : 9814699039
Rating : 4/5 (039 Downloads)

Book Synopsis Advances In 3d Integrated Circuits And Systems by : Hao Yu

Download or read book Advances In 3d Integrated Circuits And Systems written by Hao Yu and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.


Advances In 3d Integrated Circuits And Systems Related Books

Advances In 3d Integrated Circuits And Systems
Language: en
Pages: 392
Authors: Hao Yu
Categories: Technology & Engineering
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific

DOWNLOAD EBOOK

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
3D Integration in VLSI Circuits
Language: en
Pages: 211
Authors: Katsuyuki Sakuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press

DOWNLOAD EBOOK

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
Handbook of 3D Integration, Volume 1
Language: en
Pages: 798
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
3D Integration for NoC-based SoC Architectures
Language: en
Pages: 280
Authors: Abbas Sheibanyrad
Categories: Technology & Engineering
Type: BOOK - Published: 2010-11-08 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural des
Three-Dimensional Integrated Circuit Design
Language: en
Pages: 292
Authors: Yuan Xie
Categories: Technology & Engineering
Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law