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Area Array Packaging Materials
Language: en
Pages: 182
Authors: Ken Gilleo
Categories: Ball grid array technology
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional

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This engineering reference covers the most important assembly processes in modern electronic packaging.
Area Array Packaging Handbook
Language: en
Pages: 832
Authors: Ken Gilleo
Categories: Business & Economics
Type: BOOK - Published: 2002 - Publisher: McGraw Hill Professional

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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
Area Array Interconnection Handbook
Language: en
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Authors: Karl J. Puttlitz
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Electronic Packaging Materials and Their Properties
Language: en
Pages: 120
Authors: Michael Pecht
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Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packagin
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Language: en
Pages: 1471
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2007-05-26 - Publisher: Springer Science & Business Media

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-