*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packagin
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-