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Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law
Language: en
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Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Language: en
Pages: 251
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Type: BOOK - Published: 2010-12-07 - Publisher: Springer Science & Business Media
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as
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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
