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Type: BOOK - Published: 2019-04-03 - Publisher: Springer
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Language: en
Pages: 542
Pages: 542
Type: BOOK - Published: 2023-03-27 - Publisher: Springer Nature
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and e
Language: en
Pages: 294
Pages: 294
Type: BOOK - Published: 2022-04-27 - Publisher: Elsevier
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-
Language: en
Pages: 513
Pages: 513
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Language: en
Pages: 319
Pages: 319
Type: BOOK - Published: 2018-04-05 - Publisher: Springer
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the cur
