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Language: en
Pages: 270
Pages: 270
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands
Language: en
Pages: 216
Pages: 216
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semic
Language: en
Pages: 276
Pages: 276
Type: BOOK - Published: 1997-12-31 - Publisher:
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The
Language: en
Pages: 633
Pages: 633
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in
Language: en
Pages: 606
Pages: 606
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
