Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
Author | : Ting Y. Tsui |
Publisher | : |
Total Pages | : 498 |
Release | : 2006 |
ISBN-10 | : UOM:39015064810438 |
ISBN-13 | : |
Rating | : 4/5 ( Downloads) |
Book Synopsis Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects by : Ting Y. Tsui
Download or read book Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: