Related Books
Language: en
Pages: 524
Pages: 524
Type: BOOK - Published: 2004-05-14 - Publisher: Springer Science & Business Media
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos
Language: en
Pages: 435
Pages: 435
Type: BOOK - Published: 2012-02-13 - Publisher: John Wiley & Sons
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a
Language: en
Pages: 310
Pages: 310
Type: BOOK - Published: 2002 - Publisher: The Electrochemical Society
Language: en
Pages: 528
Pages: 528
Type: BOOK - Published: 2021-03-16 - Publisher: John Wiley & Sons
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building
Language: en
Pages: 365
Pages: 365
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa
