Grounding, Bonding, and Shielding Practices and Procedures for Electronic Equipments and Facilities. Volume II. Procedures for Facilities and Equipments
Author | : H. W. Denny |
Publisher | : |
Total Pages | : 302 |
Release | : 1975 |
ISBN-10 | : OCLC:227412019 |
ISBN-13 | : |
Rating | : 4/5 ( Downloads) |
Download or read book Grounding, Bonding, and Shielding Practices and Procedures for Electronic Equipments and Facilities. Volume II. Procedures for Facilities and Equipments written by H. W. Denny and published by . This book was released on 1975 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt: This three volume series sets forth a set of grounding, bonding, and shielding principles and practices for electronic equipments and facilities. In Volume 2, the principles and theories are reduced to practical steps and procedures for use in equipment and facility development. Assembly and construction, installation and checkout, and maintenance for long term use are emphasized in this Volume.