Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications
Author | : Douglas DeVoto |
Publisher | : |
Total Pages | : 23 |
Release | : 2011 |
ISBN-10 | : OCLC:969973002 |
ISBN-13 | : |
Rating | : 4/5 ( Downloads) |
Book Synopsis Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications by : Douglas DeVoto
Download or read book Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications written by Douglas DeVoto and published by . This book was released on 2011 with total page 23 pages. Available in PDF, EPUB and Kindle. Book excerpt: